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SEAM-30-03.5-S-08-2-A-K-TR

Name: Samtec SEAM-30-03.5-S-08-2-A-K-TR
Brand: Samtec
SKU: 200-SEAM3003.5S082AK
Price: 20.13 EUR
Availability: InStock

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Mouser Nr.:

200-SEAM3003.5S082AK

Raž. Nr.:

SEAM-30-03.5-S-08-2-A-K-TR

Raž.:

Samtec

Apraksts:

Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal

Datu lapa:

SEAM-30-03.5-S-08-2-A-K-TR Datu lapa (PDF)

ECAD modelis:

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Vairāk informācijas

Uzzināt vairāk par Samtec SEAM-30-03.5-S-08-2-A-K-TR

Ir noliktavā: 1 436

Noliktavas krājumi:: 1 436 Var nosūtīt uzreiz

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Izpildes laiks rūpnīcā:: 3 Nedēļas Paredzamais rūpnīcas ražošanas laiks daudzumiem, kas ir lielāki par parādīto.

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Minimums: 1 Vairāki: 1

Vienības cena:

-,-- €

Kop. cena:

-,-- €

Apr. tarifs:

Cenu noteikšana (EUR)

Daudz.	Vienības cena	Kop. cena
	20,13 €	20,13 €
	19,26 €	1 92,60 €
	18,53 €	4 63,25 €
	17,17 €	8 58,50 €
	14,75 €	14 75,00 €
Pilna Spole (pasūtiet komplektos pa 200)
	14,75 €	29 50,00 €
	14,00 €	56 00,00 €

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Produkta atribūts	Priekšmeta vērtība	Atlasīt atribūtu
Ražotājs:	Samtec
Produktu kategorija:	Board to Board un mezanīna savienotāji
RoHS:
Produkts:	Headers
Pozīciju skaits:	240 Position
Solis:	1.27 mm (0.05 in)
Rindu skaits:	8 Row
Izvada veids:	Solder
Montāžas leņķis:	Vertical
Krautnes augstums:	8.5 mm, 9.5 mm, 10 mm, 11 mm
Strāvas parametri:	2.7 A
Sprieguma kategorija:	240 VAC
Maksimālais datu pārraides ātrums:	56 Gbps
Minimālā darba temperatūra:	- 55 C
Maksimālā darba temperatūra:	+ 125 C
Kontakta pārklājums:	Gold
Kontakta materiāls:	Copper Alloy
Korpusa materiāls:	Liquid Crystal Polymer (LCP)
Sērija:	SEAM
Iepakojums:	Reel
Iepakojums:	Cut Tape
Lietojums:	Power, Signal
Zīmols:	Samtec
Datu pārraides ātrums:	56 Gbps
Montāžas veids:	SMD/SMT
Produkta tips:	Board to Board & Mezzanine Connectors
Rūpnīcas iepakojuma daudzums:	200
Apakškategorija:	Board to Board & Mezzanine Connectors
Tirdzniecības nosaukums:	SEARAY
Preces svars:	1,412 g

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Datu lapa

SEAM-30-03.5-S-08-2-A-K-TR Datu lapa (PDF)

Images

Attēls

Models

Specification Sheets

Technical Resources

Test Report (PDF)

TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

SEARAY™ SEAM Connectors

Samtec SEARAY™ SEAM Connectors offers 56Gbps PAM4 performance and up to 500 single-ended I/Os. The connectors have a 0.050" (1.27mm) pitch grid for maximum routing flexibility. Other features include rugged Edge Rate® contacts and low insertion/withdrawal forces. The series is available in 7mm to 17.5mm stack heights. Samtec SEARAY SEAM Connectors are ideally suited for power and signal applications and are compatible with UMPT / UMPS.

SEARAY™ SEAF & SEAM Connectors

Samtec SEARAY™ SEAF and SEAM Connectors feature a 1.27mm pitch grid, a rugged Edge Rate®contact system, and up to 56Gbps high-speed performance. SEAF high-density socket connectors series includes the SEAF-RA right-angle socket, the SEAF8 0.8mm open-pin-field array, the SEAFP press-fit socket, and the SEAFP-RA right-angle press-fit socket. The SEAM connectors feature low insertion/withdrawal forces and are available in 7mm to 17.5mm stack heights. Samtec SEARAY SEAF and SEAM Connectors meet IPC-A-610F and IPC J-STD-001F standards.

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.