NeoPress High-Speed Mezzanine System

Molex NeoPress High-Speed Mezzanine System creates design flexibility on space-constrained PCBs with tunable differential pairs, low stack heights, and compliant-pin terminations while producing data rates up to 28Gbps. The Molex NeoPress High-Speed Mezzanine System has been designed to employ compliant-pin termination while minimizing near-end and far-end crosstalk to match the signal integrity of NeoScale SMT Connector. The compliant pin allows engineers to redesign the board when needed and maximize its use without losing signal integrity.

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Daudz. RoHS ECAD modelis Produkts
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Strāvas parametri
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Molex Board to Board un mezanīna savienotāji NeoPress 6x14 Plug 13.5mm
Datu lapa
346Ir noliktavā
Min.: 1
Vair.: 1

Headers 252 Position 3.5 mm (0.138 in) 6 Row Solder Vertical 13.5 mm 1 A 30 VAC - 55 C + 85 C Gold Copper Liquid Crystal Polymer (LCP) 172801 Tray
Molex Board to Board un mezanīna savienotāji NeoStack 6x10 Plug 21.5mm
Datu lapa
Nav noliktavā
Min.: 320
Vair.: 160

Headers 180 Position 3.5 mm (0.138 in) 6 Row Solder Pin Vertical 1 A 30 VAC - 55 C + 85 C Gold Liquid Crystal Polymer (LCP) 172801
Molex Board to Board un mezanīna savienotāji NeoPress High-Speed Plug 3.50mm 8x20 160 Triads 480Ckt 21.50mm Conn Height Gold
Datu lapa
Nav noliktavā
Min.: 96
Vair.: 96

Headers 480 Position 3.5 mm (0.138 in) 8 Row Solder Vertical 1 A 30 V - 55 C + 85 C Gold Liquid Crystal Polymer (LCP) 172801 Tray
Molex Board to Board un mezanīna savienotāji NeoStack 6x14 Rcpt 13.5mm
Datu lapa
Noliktavā neesošas preces izpildes laiks 22 Nedēļas
Min.: 320
Vair.: 160

Receptacles 252 Position 3.5 mm (0.138 in) 6 Row Solder Vertical 13.5 mm 1 A 30 VAC - 55 C + 85 C Gold Copper Liquid Crystal Polymer (LCP) 172832 Tray
Molex Board to Board un mezanīna savienotāji NeoStack 6x10 Rcpt 18.5mm
Datu lapa
Nav noliktavā
Min.: 160
Vair.: 160

Receptacles 180 Position 3.5 mm (0.138 in) 6 Row Solder Pin Vertical 1 A 30 VAC - 55 C + 85 C Gold Liquid Crystal Polymer (LCP) 172832
Molex Board to Board un mezanīna savienotāji NeoPress High-Speed Rcpt 3.50mm 8x20 160 Triads 480Ckt 18.50mm Conn Height Gold
Datu lapa
Nav noliktavā
Min.: 96
Vair.: 96

Receptacles 480 Position 3.5 mm (0.138 in) 8 Row Solder Vertical 1 A 30 V - 55 C + 85 C Gold 172832 Tray
Molex Board to Board un mezanīna savienotāji NeoPress High-Speed Plug 3.50mm 6x10 60 Triads 180Ckt 7.50mm Conn Height Gold
Datu lapa
Nav noliktavā
Min.: 200
Vair.: 200

Receptacles 180 Position 3.5 mm (0.138 in) 6 Row Vertical 1 A 30 VAC - 55 C + 85 C Gold 173363 Tray
Molex Board to Board un mezanīna savienotāji NeoPress High-Speed Rcpt 3.50mm 6x10 60 Triads 180Ckt 7.50mm Conn Height Gold
Datu lapa
Nav noliktavā
Min.: 200
Vair.: 200

Receptacles 180 Position 3.5 mm (0.138 in) 6 Row Vertical 1 A 30 VAC - 55 C + 85 C Gold 173364 Tray
Molex Board to Board un mezanīna savienotāji 3.5mm NeoPress Plug 4x12 85Ohm 144Ckt
Datu lapa
Nav noliktavā
Min.: 300
Vair.: 300

Plugs 144 Position 3.5 mm (0.138 in) 4 Row Solder Vertical 1 A 30 VAC - 55 C + 85 C Gold Liquid Crystal Polymer (LCP) Tray