BM10 FPC-to-Board Connectors

Hirose BM10 FPC-to-Board Connectors feature stacking heights of 0.6mm or 0.8mm and a 0.4mm pitch, providing a 2.98mm depth savings. The clipping contact design gives a clear, tactile click and offers a highly reliable contact and retention force with metal fittings. The BM10 series features a dimple on the contact for shock absorption and robustness. Hirose BM10 FPC-to-Board Connectors offer solder wicking prevention and protection against dust,

Rezultāti: 10
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 20P RECP 0.8 HGHT 5 547Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Receptacles 20 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 10P HDR 0.8 HGHT 7 485Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Headers 10 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 40P HDR 0.8 HGHT 7 322Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Headers 40 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 20P HDR 0.8 HGHT 5 595Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Headers 20 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 40P RECP 0.8 HGHT 7 237Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Receptacles 40 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 16P RECP 0.8 HGHT 3 200Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Receptacles 16 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 24P RECP 0.8 HGHT Nav noliktavā
Min.: 8 000
Vair.: 8 000
Rullis: 8 000

Receptacles 24 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 30P RECP 0.8 HGHT Nav noliktavā
Min.: 8 000
Vair.: 8 000
Rullis: 8 000

Receptacles 30 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 16P HDR 0.8 HGHT Nav noliktavā
Min.: 1
Vair.: 1
Rullis: 8 000

Headers 16 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 0.4MM FPC TO BOARD 10P RECP 0.8 HGHT N/A
Min.: 1
Vair.: 1
Rullis: 8 000

Receptacles 10 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 0.8 mm 300 mA 30 V - 35 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) BM10 Reel, Cut Tape, MouseReel