Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Rezultāti: 6
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Advanced Thermal Solutions Siltumuzņēmēji Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158Ir noliktavā
100Paredzamais 03.04.2026
Min.: 1
Vair.: 1

Advanced Thermal Solutions Siltumuzņēmēji Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 342Ir noliktavā
Min.: 1
Vair.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Siltumuzņēmēji maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93Ir noliktavā
Min.: 1
Vair.: 1

Advanced Thermal Solutions Siltumuzņēmēji maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 102Ir noliktavā
Min.: 1
Vair.: 1

Advanced Thermal Solutions Siltumuzņēmēji Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 78Ir noliktavā
100Paredzamais 04.03.2026
Min.: 1
Vair.: 1

Advanced Thermal Solutions Siltumuzņēmēji Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 27Ir noliktavā
100Paredzamais 27.03.2026
Min.: 1
Vair.: 1