Rezultāti: 4
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Augstums Darba barošanas spriegums Sērija
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Noliktavā neesošas preces izpildes laiks 14 Nedēļas
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25.5 mm 12 V conga-TC570 Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. Nav noliktavā
Min.: 1
Vair.: 1
25.5 mm 12 V conga-TC570 Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. Nav noliktavā
Min.: 1
Vair.: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. Nav noliktavā
Min.: 1
Vair.: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3