56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay® Extreme Performance (EP) and AcceleRate® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

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Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
Datu lapa
558Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 500

Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
Datu lapa
837Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 650

Sockets 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datu lapa
300Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 175

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HP High-Performance Array Terminal
Datu lapa
270Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
Datu lapa
82Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 500

Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datu lapa
87Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 475

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HP Vertical, High-Performance Array Socket
Datu lapa
260Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight 1.2 A 150 VAC/212 VDC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HP Vertical, High-Performance Array Socket
Datu lapa
260Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HP High-Performance Array Terminal
Datu lapa
240Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
Datu lapa
77Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100
APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
Datu lapa
250Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Terminal
Datu lapa
273Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 275

Contacts Solder Gold Copper Alloy NVAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Terminal
Datu lapa
3 408Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 275

Headers 32 Position 0.8 mm (0.031 in) 6 Row Solder Vertical 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Terminal
Datu lapa
168Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 175

Contacts Solder Gold Copper Alloy NVAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
Datu lapa
15Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 125
APF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Socket
Datu lapa
29Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 0.8 mm (0.031 in) Solder 2.1 A, 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datu lapa
350Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 475

Headers 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal
Datu lapa
164Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 175
Contacts 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.4 A 155 VAC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datu lapa
313Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 475

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datu lapa
87Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 175

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Socket
Datu lapa
427Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 550

Sockets 32 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Socket
Datu lapa
170Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 275

Sockets 32 Position 0.8 mm (0.031 in) 6 Row Solder Vertical 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Terminal
Datu lapa
285Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 400

Headers 32 Position 0.8 mm (0.031 in) 4 Row Solder Vertical 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Socket
Datu lapa
750Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Sockets 16 Position 0.8 mm, 1.8 mm 2 Row Solder Balls Straight 2.1 A, 9.6 A 200 VAC 112 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm NovaRay Extreme Density & Performance Socket
Datu lapa
400Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 400

Sockets 48 Position 0.8 mm (0.031 in) 3 Row Solder Vertical 9.6 A 200 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) NVAF Reel, Cut Tape