FX11 B2B Connectors with Ground Plate

Hirose FX11 Series B2B Connectors are 0.5mm pitch headers and receptacles with optional ground plates on both sides of the header and receptacle to improve transmission characteristics. Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. The FX11 is structured to prevent solder wicking via a solder gap in the contact SMT portion. With a stacking height of either 2mm, 2.5mm, or 3mm, the FX11 series comes in 60, 80, 100, or 120 contact positions, provides additional solder weld strength through metal fittings. 

Rezultāti: 185
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Hirose Connector Board to Board un mezanīna savienotāji REC 140POS W/O POSTS SMT 1 342Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 120P W/POSTS SMT 1 835Ir noliktavā
Min.: 1
Vair.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 60P M HDR STRT SMT GIDE POST GROUND PLT 712Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 66 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 80POS W/O POSTS SMT 88Ir noliktavā
210Paredzamais 22.04.2026
Min.: 1
Vair.: 1

Headers 88 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 100P STRT SMT HEADER GROUND PLATE GOLD 118Ir noliktavā
Min.: 1
Vair.: 1

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 3 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 68POS W/POSTS SMD CONN RCPT 250Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 68 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji HDR 92 POS 0.5mm .5mm Solder RA SMD T 104Ir noliktavā
Min.: 1
Vair.: 1

Headers 92 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 68POS W/POSTS SMD CONN HEADER 230Ir noliktavā
Min.: 1
Vair.: 1

Headers 68 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji REC 80POS W/O POSTS SMT 119Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 88 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 92POS W/O POSTS SMD CONN RCPT 65Ir noliktavā
Min.: 1
Vair.: 1

Receptacles FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 100P M HDR STRT SMT GIDE POST GROUND PLT 749Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 120P M HDR STRT SMT GIDE POST GROUND PLT 1 000Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 120 Position Solder Horizontal 2 mm FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji RCP 116 POS 0.5mm .5mm Solder RA SMD T 234Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 116 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 140P F RECEP SRT SMT NO GDE PST NO GRD P 244Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 120P M HDR STRT SMT GIDE POST GROUND PLT 2 688Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 100P F RECEP SRT SMT NO GDE PST W/GRD PL 247Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2.5 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji REC 92P W/POSTS SMT 292Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 92 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 140 POS 0.5mm .5mm Solder RA SMD T 1 042Ir noliktavā
Min.: 1
Vair.: 1

Headers 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji RCP 140 POS 0.5mm .5mm Solder RA SMD T 453Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 140P F RECEP SRT SMT GIDE POST NO GRD PL 1 758Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 140 Position Solder Horizontal 2 mm FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji REC 60P W/POSTS SMT 560Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 60P F RECEP SRT SMT GIDE POST GROUND PLT 888Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 80P F RECEP SRT SMT GIDE POST GROUND PLT 1 055Ir noliktavā
1 000Paredzamais 11.03.2026
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 80 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 100POS W/O POSTS SMT 768Ir noliktavā
Min.: 1
Vair.: 1

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 140P M HDR STRT SMT NO GDE PST NO GRD PL 1 301Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel