nRF9161 System-in-Package (SiP)

Nordic Semiconductor nRF9161 System-in-Package (SiP) offers low-power LTE technology, advanced processing capabilities, and robust security functions. These features deliver high performance and versatility in cellular IoT and DECT NR+ applications. The nRF9161 SiP includes a programmable Arm® Cortex®-M33 system-on-chip (SoC), an RF front-end, a comprehensive LTE modem with GNSS and DECT NR+ capability, a power management system (PMIC), and the necessary passives and crystals. Nordic Semiconductor nRF9161 SIP is housed within a compact 10mm x 16mm design and is certified for global operation.

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Barošanas spriegums - min.
Barošanas spriegums - maks.
Minimālā darba temperatūra
Maksimālā darba temperatūra
Izmēri
Protokols - šūnas, NBIoT, LTE
Protokols - GPS, GLONASS
Iepakojums
Nordic Semiconductor Multiprotokola moduļi Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
Datu lapa
4 414Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Nordic Semiconductor Multiprotokola moduļi Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
Datu lapa
400Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape