DensiStak™ Board-to-Board Connectors

Amphenol FCI DensiStak™ Board-to-Board Connectors are high-density connectors with a dual-beam contact system to ensure reliable performance. The connectors feature an 11-row design with up to 1034 pin positions and an open-pin field design for added flexibility. The DensiStak connectors offer high-speed performance of up to 16Gb/s and meet PCIe® Gen 4, Ethernet, USB, DP, and MIPI protocols. The Amphenol FCI DensiStak Board-to-Board Connectors are constructed with a UL 94V-0-rated housing material that can withstand harsh environments. The connectors are RoHS and USCAR-2 compliant, ideal for automotive applications, including Advanced Driver Assistance Systems (ADAS). The DensiStak devices are also suitable for servers, data storage, artificial intelligence (AI), industrial, and sensing/instrumentation applications.

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Daudz. RoHS ECAD modelis Produkts
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Iepakojums
Amphenol FCI Board to Board un mezanīna savienotāji DensiStak Header H2 .8mm x 1.25mm 550Pos 11 x 50 3u 8mm STK HT
Datu lapa
520Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 260

Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji DensiStak Receptacle R6 .8mm x 1.25mm 550Pos 11 x 50 3u 8mm STK HT
Datu lapa
640Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 320

Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji DensiStak Header H2 .8mm x 1.25mm 616Pos 11 x 56 3u 8mm STK HT
Datu lapa
Noliktavā neesošas preces izpildes laiks 10 Nedēļas
Min.: 520
Vair.: 520
Rullis: 260

Headers 616 Position 11 Row Solder 8 mm 800 mA, 4 A 100 VAC, 100 VDC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
Amphenol FCI Board to Board un mezanīna savienotāji DensiStak Receptacle R6 .8mm x 1.25mm 616Pos 11 x 56 3u 8mm STK HT
Datu lapa
Noliktavā neesošas preces izpildes laiks 10 Nedēļas
Min.: 640
Vair.: 640
Rullis: 320

Receptacles 616 Position 11 Row Solder 8 mm 800 mA, 4 A 100 VAC, 100 VDC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel