EasyPACK™ TRENCHSTOP™ IGBT7 Modules

Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drive applications. The modules offer lower static losses, higher power density, and softer switching. A significant increase in power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.

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Infineon Technologies IGBT moduļi EasyPACK module with TRENCHSTOP IGBT7/4 and emitter controlled 7 diode and PressFIT / NTC
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