MicroSpeed Triple High-Speed Connectors

TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors are ideally suited for next-generation communication standards such as Next Generation Ethernet 100Gbit/s (IEEE 802.3ba), optical internetworking forum (OIF), and the Internet of Things (loT). These shielded, high-density connectors utilize three rows to enable data rates of up to 25Gbit/s. They have SMT terminals that provide a high contact density with 3 x 25 positions in a 1mm pitch. Applications for TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors include data communication and telecommunication, high-end computing, medical technology, and industrial automation.

Rezultāti: 2
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Kontakta pārklājums Sērija Iepakojums
TE Connectivity / ERNI Board to Board un mezanīna savienotāji MSPEED 75 M SMD M1 BE ABC VVV 137 176 * Noliktavā neesošas preces izpildes laiks 15 Nedēļas
Min.: 450
Vair.: 450
Rullis: 450

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 1 mm 1 A Gold MicroSpeed Reel
TE Connectivity / ERNI Board to Board un mezanīna savienotāji MSPEED 75 F SMD F4 BE ABC VVV 137 176 * Noliktavā neesošas preces izpildes laiks 15 Nedēļas
Min.: 550
Vair.: 550
Rullis: 550

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 4 mm 1 A Gold MicroSpeed Reel