LP Array Board to Board un mezanīna savienotāji

Rezultāti: 152
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 343Ir noliktavā
Min.: 1
Vair.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 730Ir noliktavā
Min.: 1
Vair.: 1
: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 316Ir noliktavā
Min.: 1
Vair.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 375Ir noliktavā
Min.: 1
Vair.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 313Ir noliktavā
Min.: 1
Vair.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 385Ir noliktavā
Min.: 1
Vair.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 390Ir noliktavā
Min.: 1
Vair.: 1
: 500

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1 183Ir noliktavā
Min.: 1
Vair.: 1
: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 1.27MM LP ARRAY HS HD ARRAY 288Ir noliktavā
Min.: 1
Vair.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460Ir noliktavā
Min.: 1
Vair.: 1
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 457Ir noliktavā
Min.: 1
Vair.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 517Ir noliktavā
Min.: 1
Vair.: 1
: 550

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 153Ir noliktavā
Min.: 1
Vair.: 1
: 500

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 459Ir noliktavā
Min.: 1
Vair.: 1
: 550

Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 439Ir noliktavā
Min.: 1
Vair.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 75Ir noliktavā
Min.: 1
Vair.: 1
: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 633Ir noliktavā
Min.: 1
Vair.: 1
: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 306Ir noliktavā
Min.: 1
Vair.: 1
: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162Ir noliktavā
Min.: 1
Vair.: 1
: 325

LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 175Ir noliktavā
Min.: 1
Vair.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 232Ir noliktavā
Min.: 1
Vair.: 1
: 300

LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 186Ir noliktavā
Min.: 1
Vair.: 1
: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 168Ir noliktavā
Min.: 1
Vair.: 1
: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 191Ir noliktavā
Min.: 1
Vair.: 1
: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 215Ir noliktavā
Min.: 1
Vair.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape