Samtec LP Array Board to Board un mezanīna savienotāji

Rezultāti: 152
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Datu pārraides ātrums Sērija Iepakojums
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 334Ir noliktavā
Nogriezta lente
21,67 €
19,50 €
18,43 €
17,86 €
17,82 €
Spole
15,42 €
Min.: 1
Vair.: 1
: 325
Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 296Ir noliktavā
Nogriezta lente
24,68 €
21,92 €
20,79 €
20,49 €
19,70 €
Spole
18,54 €
Min.: 1
Vair.: 1
: 300
Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 555Ir noliktavā
Nogriezta lente
10,19 €
8,77 €
8,13 €
7,73 €
Spole
6,70 €
Min.: 1
Vair.: 1
: 500
Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162Ir noliktavā
Nogriezta lente
13,58 €
11,54 €
10,82 €
10,30 €
9,96 €
Spole
8,46 €
Min.: 1
Vair.: 1
: 325
LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 373Ir noliktavā
Nogriezta lente
23,33 €
21,69 €
20,71 €
20,49 €
20,28 €
Spole
18,20 €
Min.: 1
Vair.: 1
: 300
Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 380Ir noliktavā
Nogriezta lente
23,01 €
20,55 €
18,74 €
18,57 €
18,55 €
Spole
16,72 €
Min.: 1
Vair.: 1
: 300
Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 169Ir noliktavā
Nogriezta lente
11,60 €
9,93 €
9,34 €
8,87 €
Spole
7,11 €
Min.: 1
Vair.: 1
: 475
Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 71Ir noliktavā
Nogriezta lente
22,40 €
21,50 €
20,17 €
19,85 €
Spole
18,88 €
Min.: 1
Vair.: 1
: 325
Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 243Ir noliktavā
Nogriezta lente
32,83 €
31,38 €
30,20 €
27,99 €
Spole
22,56 €
Min.: 1
Vair.: 1
: 300
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 540Ir noliktavā
Nogriezta lente
21,57 €
20,62 €
19,85 €
18,40 €
Spole
15,84 €
Min.: 1
Vair.: 1
: 300
LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 204Ir noliktavā
Nogriezta lente
30,28 €
28,95 €
27,86 €
25,83 €
Spole
20,81 €
Min.: 1
Vair.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 381Ir noliktavā
Nogriezta lente
12,38 €
11,83 €
11,39 €
10,55 €
Spole
7,77 €
Min.: 1
Vair.: 1
: 500
Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 353Ir noliktavā
Nogriezta lente
13,92 €
13,31 €
12,81 €
11,89 €
Spole
9,40 €
Min.: 1
Vair.: 1
: 475
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 191Ir noliktavā
Nogriezta lente
11,88 €
11,87 €
Spole
10,27 €
Min.: 1
Vair.: 1
: 300
Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 139Ir noliktavā
Nogriezta lente
32,15 €
30,74 €
29,58 €
27,42 €
Spole
21,41 €
Min.: 1
Vair.: 1
: 300
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 99Ir noliktavā
Nogriezta lente
13,67 €
11,61 €
10,89 €
10,68 €
9,72 €
Spole
8,33 €
Min.: 1
Vair.: 1
: 500
Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 18Ir noliktavā
Nogriezta lente
14,22 €
13,59 €
12,80 €
11,86 €
Spole
8,82 €
Min.: 1
Vair.: 1
: 450
Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 1.27MM LP ARRAY HS HD ARRAY 278Ir noliktavā
Nogriezta lente
18,58 €
17,77 €
17,11 €
15,85 €
Spole
12,49 €
Min.: 1
Vair.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 367Ir noliktavā
1 400Pēc pasūtījuma
Nogriezta lente
8,03 €
6,83 €
6,40 €
6,10 €
Spole
4,89 €
Min.: 1
Vair.: 1
: 700
Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 245Ir noliktavā
550Paredzamais 02.02.2027
Nogriezta lente
11,23 €
9,55 €
8,95 €
8,52 €
Spole
7,56 €
Min.: 1
Vair.: 1
: 550
Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 444Ir noliktavā
Nogriezta lente
13,16 €
11,16 €
10,48 €
9,99 €
9,63 €
Spole
8,18 €
Min.: 1
Vair.: 1
: 550
Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 355Ir noliktavā
Nogriezta lente
18,50 €
15,71 €
14,73 €
14,04 €
13,98 €
Spole
11,87 €
Min.: 1
Vair.: 1
: 350
Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 449Ir noliktavā
Nogriezta lente
16,44 €
13,98 €
13,10 €
12,48 €
Spole
10,43 €
Min.: 1
Vair.: 1
: 550
Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 599Ir noliktavā
Nogriezta lente
19,71 €
18,78 €
18,17 €
Spole
15,13 €
Min.: 1
Vair.: 1
: 350
Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 28 Gbps LPAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 511Ir noliktavā
Nogriezta lente
27,16 €
23,09 €
21,65 €
21,26 €
Spole
18,06 €
Min.: 1
Vair.: 1
: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape