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Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu.
Daudz. RoHS
congatec Dators uz moduļiem - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.
Datu lapa
22Ir noliktavā
Min.: 1
Vair.: 1

congatec Izstrādes plates un komplekti - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
Datu lapa
21Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM QSEVEN INTEL ATOM E3845 BAY TRAIL
Datu lapa
6Ir noliktavā
Min.: 1
Vair.: 1

congatec Izstrādes plates un komplekti - x86 EVALUATION CARRIER BRD COM EXP TYPE 10
Datu lapa
3Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
Datu lapa
1Ir noliktavā
Min.: 1
Vair.: 1
congatec Dators uz moduļiem - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.
Datu lapa
4Ir noliktavā
Min.: 1
Vair.: 1

congatec Izstrādes plates un komplekti - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
Datu lapa
5Ir noliktavā
35Pēc pasūtījuma
Min.: 1
Vair.: 1

congatec Izstrādes plates un komplekti - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
Datu lapa
19Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.
Datu lapa
20Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
Datu lapa
1Ir noliktavā
Min.: 1
Vair.: 1



congatec Siltumuzņēmēji Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
Datu lapa
7Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
Datu lapa
19Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
Datu lapa
1Ir noliktavā
Min.: 1
Vair.: 1

congatec Siltumuzņēmēji Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
Datu lapa
87Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface
Datu lapa
94Ir noliktavā
Min.: 1
Vair.: 1

congatec HPC/sILH-CSA-HP-T
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Datu lapa
1Ir noliktavā
Min.: 1
Vair.: 1
congatec Izstrādes plates un komplekti - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0
Datu lapa
1Ir noliktavā
3Paredzamais 25.05.2026
Min.: 1
Vair.: 1


congatec Datoru kabeļi RS232 console adaptor cable 67Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr
Datu lapa
14Ir noliktavā
Min.: 1
Vair.: 1

congatec Dators uz moduļiem - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran
Datu lapa
15Ir noliktavā
Min.: 1
Vair.: 1

congatec Siltumuzņēmēji Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datu lapa
17Ir noliktavā
20Paredzamais 06.05.2026
Min.: 1
Vair.: 1

congatec CPU un mikroshēmu dzesētāji Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
Datu lapa
2Ir noliktavā
3Paredzamais 06.05.2026
Min.: 1
Vair.: 1

congatec conga-QA3/E3845-4G eMMC16
congatec Dators uz moduļiem - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP
Datu lapa
10Ir noliktavā
Min.: 1
Vair.: 1


congatec Taisnstūra kabeļu komplekti Cable for Backlight with JST ZHR-8 connector, 50cm, Open End, matches with conga-JC370.
Datu lapa
1Ir noliktavā
Min.: 1
Vair.: 1
congatec CPU un mikroshēmu dzesētāji Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
Datu lapa
2Ir noliktavā
Min.: 1
Vair.: 1