NeXLev® Parallel Board-to-Board Connectors

Amphenol TCS NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance.

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Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept 380 Solder Balls
Datu lapa
48Ir noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Plug Solder Balls
Datu lapa
20Ir noliktavā
Min.: 20
Vair.: 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept Solder Balls
Datu lapa
20Ir noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept 380 Solder Balls
Datu lapa
Noliktavā neesošas preces izpildes laiks 26 Nedēļas
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept 380 Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept 380 Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept 570 Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept 570 Solder Balls
Datu lapa
Nav noliktavā
Min.: 40
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept 570 Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept 570 Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept 570 Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 300P NeXLev Recept Solder Balls
Datu lapa
Nav noliktavā
Min.: 20
Vair.: 20

Receptacles 300 Position 1.15 mm (0.045 in) BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Plug 380 Solder Balls
Datu lapa
Nav noliktavā
Min.: 96
Vair.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Plug Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Plug 380 Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Plug Solder Balls
Datu lapa
Noliktavā neesošas preces izpildes laiks 18 Nedēļas
Min.: 24
Vair.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board un mezanīna savienotāji 200P NeXLev Plug 380 Solder Balls
Datu lapa
Nav noliktavā
Min.: 24
Vair.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev