Ultra-Micro Connector Solutions

Samtec Ultra-Micro Connector Solutions feature Razor Beam™ LP ultra-micro blade and beam fine-pitch connectors available on 0.40mm and 0.50mm pitches with stack heights as low as 2mm. These connectors are ideal for small and fast applications, offering speeds up to 56Gbps PAM4 (SS5/ST5). The connectors feature a slim body design and are engineered to save space on the X, Y, and Z axes. Samtec Ultra-Micro Connector Solutions products can be utilized at both the component level and system level to ensure full system optimization. Applications include 5G networking, military/aerospace, medical, artificial intelligence (AI), machine learning, instrumentation, and more.

Rezultāti: 167
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Samtec Board to Board un mezanīna savienotāji 0.40 mm Micro Blade & Beam Ultra Fine Pitch Header 9 468Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 125

Headers 40 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 155 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST4 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 1 511Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 225

Sockets 20 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm, 5.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 7 670Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 200

Headers 30 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 2 342Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 075

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 3 316Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 075

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 1 549Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 925

Headers 80 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Ultra Low Profile Terminal Strip 1 715Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 450

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 2.1 A 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) TLH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Low Profile Blade & Beam Socket Strip 2 597Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 950

Sockets 20 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 2.31 mm 2.6 A 188 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) LSH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.40MM MICRO BLADE & BEAM SCKT 2 076Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 150

Sockets 30 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm, 4.5 mm, 5.5 mm 1.6 A 155 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS4 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 1 014Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 075

Sockets 30 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm, 6 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 2 221Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 200

Headers 20 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 824Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 825

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Ultra Low Profile Terminal Strip 6 034Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 350

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2.1 A - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) TLH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 690Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 200

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 2 139Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 825

Headers 160 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Low Profile Blade & Beam Socket Strip 826Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 950

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 2.31 mm 2.6 A 188 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) LSH Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Low Profile Blade & Beam Terminal Strip 1 559Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 900

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 2.31 mm 2.6 A 188 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) LTH Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 1 358Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 225

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm, 5.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 1 507Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 225

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm, 5.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 4 641Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 225

Sockets 30 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4 mm, 4.5 mm, 5.5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Socket 1 134Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 075

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm, 6 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) SS5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.40 mm Micro Blade & Beam Ultra Fine Pitch Header 845Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 850

Headers 100 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 155 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST4 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Low-Profile Header 988Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 075

Headers 30 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 4.5 mm, 5 mm 1.6 A 200 VAC 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST5 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Micro Blade & Beam Ultra Low Profile Socket Strip 1 092Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 450

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Vertical 2.1 A 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SLH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.40 mm Micro Blade & Beam Ultra Fine Pitch Header 2 101Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 125

Headers 30 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm, 4.5 mm 1.6 A 155 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ST4 Reel, Cut Tape, MouseReel