Q Rate® QRM8/QRF8 .0315" (0.80mm) Pitch Connectors

Samtec Q Rate® QRM8/QRF8 .0315" (0.80mm) Pitch Connectors feature a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance. These high-speed connectors feature a 0.80mm pitch, 1.20mm contact wipe, up to 156 positions, and performance to 28Gbps. The Q Rate portfolio includes QRF8 sockets, QRM8 headers, high-speed socket strips in right angle (QRF8-RA) and differential pair (QRF8-DP), as well as high-speed terminal strips in right angle (QRM8-RA) and differential pair (QRM8-DP). The standard and "-DP" connectors all offer a slim 4.60mm width, while the "-RA" variant has a low 5.13mm profile. Samtec Q Rate QRM8/QRF8 .0315" (0.80mm) Pitch Connectors operate in a -55°C to +125°C temperature range.

Rezultāti: 261
Atlasīt Attēls Detaļas Nr.
 Raž.
Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu.
Daudz. RoHS ECAD modelis Produkts
Pozīciju skaits
Solis
Rindu skaits
Izvada veids
Montāžas leņķis
Krautnes augstums
Strāvas parametri
Sprieguma kategorija
Maksimālais datu pārraides ātrums
Minimālā darba temperatūra
Maksimālā darba temperatūra
Kontakta pārklājums
Kontakta materiāls
Korpusa materiāls
Sērija
Iepakojums
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
346Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 450

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
117Ir noliktavā
Min.: 1
Vair.: 1

Headers 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
484Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 450

Sockets 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
365Ir noliktavā
Min.: 1
Vair.: 1

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
106Ir noliktavā
Min.: 1
Vair.: 1

Headers 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 12 mm, 14 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
63Ir noliktavā
Min.: 1
Vair.: 1

Headers 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
127Ir noliktavā
Min.: 1
Vair.: 1

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
106Ir noliktavā
Min.: 1
Vair.: 1

Headers 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
113Ir noliktavā
Min.: 1
Vair.: 1

Headers 36 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
170Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 450

Headers 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 9 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
284Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 450

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
160Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80MM Q RATE SLIM GP SOCKET
Datu lapa
1 060Ir noliktavā
Min.: 1
Vair.: 1

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
145Ir noliktavā
Min.: 1
Vair.: 1

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
350Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
170Ir noliktavā
Min.: 1
Vair.: 1

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 9 mm, 12 mm, 14 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
896Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Sockets 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2.2 A 215 VAC - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
61Ir noliktavā
Min.: 1
Vair.: 1

Sockets 104 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
172Ir noliktavā
Min.: 1
Vair.: 1

Sockets 104 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
82Ir noliktavā
Min.: 1
Vair.: 1

Sockets 156 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
302Ir noliktavā
Min.: 1
Vair.: 1

Sockets 156 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Socket
Datu lapa
557Ir noliktavā
Min.: 1
Vair.: 1

Sockets 156 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 10 mm, 12 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Beryllium Copper Liquid Crystal Polymer (LCP) QRF8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
205Ir noliktavā
220Paredzamais 04.05.2026
Min.: 1
Vair.: 1

Headers 52 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
285Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 275

Headers 52 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 2.2 A 215 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Rate Slim Body Ground Plane Header
Datu lapa
986Ir noliktavā
615Paredzamais 23.03.2026
Min.: 1
Vair.: 1

Headers 52 Position 0.8 mm (0.031 in) 2 Row Solder Straight 7 mm, 9 mm 2.2 A 215 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QRM8 Tray