High Speed Board to Board Connectors

Hirose Electric produces a variety of High-Speed Board to Board Connectors. These High-Speed Board to Board Connectors are ideal for mezzanine applications, coplanar or vertical, with optional ground plates, and a wide range of positions and stacking heights. Hirose Connectors include the FX10, FX11, FX18, and IT3 series connectors.

Rezultāti: 260
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Hirose Connector Board to Board un mezanīna savienotāji REC 140POS W/O POSTS SMT 1 342Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 120P W/POSTS SMT 1 835Ir noliktavā
Min.: 1
Vair.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 168P HEADER W/ POST SMT OIF-MSA-100GLH 289Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 168 Position 0.5 mm (0.02 in) Solder Straight 300 mA 50 VAC 15 Gbps - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX10 Reel, Cut Tape

Hirose Connector Board to Board un mezanīna savienotāji 0.8MM 40P HDR VERT SMT 4 088Ir noliktavā
Min.: 1
Vair.: 1

Headers 40 Position 0.8 mm (0.031 in) Solder Straight 10 mm 500 mA, 3 A 100 VAC 10 Gbps - 55 C + 80 C Gold Phosphor Bronze Polyamide (PA) FX18 Tray
Hirose Connector Board to Board un mezanīna savienotāji 60P M HDR STRT SMT GIDE POST GROUND PLT 712Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 66 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 80POS W/O POSTS SMT 88Ir noliktavā
210Paredzamais 22.04.2026
Min.: 1
Vair.: 1

Headers 88 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 300P RECPT SMT MOUNTING SIDE 12Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 300 Position 0.875 mm (0.034 in) Solder Vertical 1 A 50 V Gold Copper Alloy Liquid Crystal Polymer (LCP) IT3 Tray
Hirose Connector Board to Board un mezanīna savienotāji 100P STRT SMT HEADER GROUND PLATE GOLD 118Ir noliktavā
Min.: 1
Vair.: 1

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 3 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 300P INTERPOSER 22MM HEIGHT 90Ir noliktavā
Min.: 1
Vair.: 1

Plugs 300 Position 0.875 mm (0.034 in) Solder Vertical 22 mm 1 A 50 V Gold Copper Alloy Liquid Crystal Polymer (LCP) IT3 Tray
Hirose Connector Board to Board un mezanīna savienotāji HDR 92 POS 0.5mm .5mm Solder RA SMD T 104Ir noliktavā
Min.: 1
Vair.: 1

Headers 92 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji REC 140POS W/O POST SMT 100Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 140 Position 0.5 mm (0.02 in) Solder Straight 300 mA 50 VAC 15 Gbps - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX10 Tray
Hirose Connector Board to Board un mezanīna savienotāji REC 80POS W/O POSTS SMT 119Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 88 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 100P RECPT SMT MOUNTING SIDE 6Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 100 Position 0.875 mm (0.034 in) Solder Vertical 1 A 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) IT3 Tray
Hirose Connector Board to Board un mezanīna savienotāji 100P M HDR STRT SMT GIDE POST GROUND PLT 749Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 120P M HDR STRT SMT GIDE POST GROUND PLT 1 000Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 120 Position Solder Horizontal 2 mm FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji RCP 116 POS 0.5mm .5mm Solder RA SMD T 234Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 116 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji 140P F RECEP SRT SMT NO GDE PST NO GRD P 244Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel

Hirose Connector Board to Board un mezanīna savienotāji 168P RECEPT W/ POST SMT OIF-MSA-100GLH 46Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Receptacles 168 Position 0.5 mm (0.02 in) Solder Straight 300 mA 50 VAC 15 Gbps - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX10 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 120P M HDR STRT SMT GIDE POST GROUND PLT 2 688Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji 100P F RECEP SRT SMT NO GDE PST W/GRD PL 247Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 100 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2.5 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji REC 92P W/POSTS SMT 292Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

Receptacles 92 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HDR 168P W/POST SMT 2 067Ir noliktavā
Min.: 1
Vair.: 1

Headers 168 Position 0.5 mm (0.02 in) Solder Straight 300 mA 50 VAC 15 Gbps - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX10 Tray
Hirose Connector Board to Board un mezanīna savienotāji HDR 168P SMT 3 233Ir noliktavā
3 750Paredzamais 15.04.2026
Min.: 1
Vair.: 1

Headers 168 Position 0.5 mm (0.02 in) Solder Straight 300 mA 50 VAC 15 Gbps - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX10 Tray
Hirose Connector Board to Board un mezanīna savienotāji HDR 140 POS 0.5mm .5mm Solder RA SMD T 1 042Ir noliktavā
Min.: 1
Vair.: 1

Headers 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) FX11 Tray
Hirose Connector Board to Board un mezanīna savienotāji RCP 140 POS 0.5mm .5mm Solder RA SMD T 453Ir noliktavā
Min.: 1
Vair.: 1

Receptacles 140 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 mm 300 mA 50 V - 55 C + 85 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) FX11 Tray