Q Strip™ QTE High-Speed Ground Plane Headers

Samtec Q Strip™ QTE High-Speed Ground Plane Headers are an Extended Life Product (E.L.P.™) and offer 5mm to 30mm stack heights and up to 200 positions. The QTE series features a 225VAC voltage rating, a 2A per pin current rating, and a 28+Gbps solution. These headers have an integral metal plane that is useful for power or ground. Samtec Q Strip™ QTE High-Speed Ground Plane Headers are compatible with UMPT/UMPS for flexible two-piece power/signal solutions.

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Iepakojums
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
162Ir noliktavā
Min.: 1
Vair.: 1

Connectors 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 8 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
199Ir noliktavā
Min.: 1
Vair.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
1 204Ir noliktavā
Min.: 1
Vair.: 1

Connectors 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
326Ir noliktavā
Min.: 1
Vair.: 1

Connectors 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
1 060Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 150

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
433Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
763Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
544Ir noliktavā
Min.: 1
Vair.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
177Ir noliktavā
Min.: 1
Vair.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
171Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
166Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 125

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 14 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
567Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 425

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
480Ir noliktavā
Min.: 1
Vair.: 1

Connectors 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
1 488Ir noliktavā
Min.: 1
Vair.: 1

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
3 382Ir noliktavā
Min.: 1
Vair.: 1

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
3 488Ir noliktavā
Min.: 1
Vair.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
913Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 450

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
262Ir noliktavā
Min.: 1
Vair.: 1

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 8 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
40Ir noliktavā
Min.: 1
Vair.: 1

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
207Ir noliktavā
Min.: 1
Vair.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 25 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
425Ir noliktavā
Min.: 1
Vair.: 1

Connectors 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
367Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 450

Connectors 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
222Ir noliktavā
Min.: 1
Vair.: 1

Headers 80 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
582Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Connectors 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 8 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
290Ir noliktavā
Min.: 1
Vair.: 1

Connectors 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray