ER8 Board-to-Board Connectors

Hirose Electric ER8 Board-to-Board Connectors feature an 0.8mm pitch in stacking and vertical variations, 7mm to 12mm stacking height, and 10 to 140 positions with stacking, vertical, and coplanar variations. The connectors incorporate a large mating guide, while the alignment on the plug offers easy insertion operation. The insertion loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the IEEE802.3ap specification for 10Gbps with plenty of margins. Other features include 0.5A current rating, 100VAC voltage rating, and 85Ω differential impedance at 35ps rise time (20% to 80%). Hirose Electric ER8 Board-to-Board Connectors operate in a -55°C to +125°C temperature range.

Rezultāti: 83
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 120P STRGHT 0.76um 390Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 40P STRGHT 0.76um 654Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 30P STRGHT 0.76um 776Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 400

Receptacles 30 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 60P STRGHT 0.76um 492Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 60 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 10P STRGHT 0.76um 945Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Headers 10 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 120P STRGHT 0.76um 375Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 20P STRGHT 0.76um 514Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 475

Headers 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 100P STRGHT 0.76um 353Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 100 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 50P STRGHT 0.76um 440Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 50 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 100P STRGHT 0.76um 270Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 100 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 50P STRGHT 0.76um 236Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Receptacles 50 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 70P STRGHT 0.76um 188Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Receptacles 70 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 120P STRGHT 0.76um 596Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 60P STRGHT 0.76um 493Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Headers 60 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 70P STRGHT 0.76um 433Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 70 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 80P STRGHT 0.76um 1 236Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 350

Headers 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 80P STRGHT 0.76um 738Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 300

Receptacles 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 30P STRGHT 0.76um 431Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 475

Receptacles 30 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape, MouseReel
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 80P STRGHT 0.76um 989Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 10P STRGHT 0.76um 323Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 450

Headers 10 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans HDR 20P STRGHT 0.76um 310Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Headers 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 20P STRGHT 0.76um 375Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 500

Receptacles 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 20P STRGHT 0.76um 419Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 40P STRGHT 0.76um 380Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape
Hirose Connector Board to Board un mezanīna savienotāji HighSpeed Trans RCPT 50P STRGHT 0.76um 393Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Receptacles 50 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 100 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ER8 Reel, Cut Tape, MouseReel