BergStak® 0.40mm Board-to-Board Connectors

Amphenol FCI BergStak® 0.40mm Board-to-Board Connectors offer a 0.3A per contact current rating, 50MΩ insulation resistance, and 30VDC voltage rating. These connectors feature a compact design with stack heights of 1.5mm and 4mm with 10 to 100 positions. The contact lock function provides high mating reliability, while the shock-absorbing ribs on the housing make this connector highly suitable for high-vibration applications. Amphenol FCI BergStak 0.40mm Connectors support signal speeds of up to 16Gb/s and can be soldered on FPC for flexible board-to-board connections.

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Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 80 Positions, Header, 1.5mm Stack Height
Datu lapa
4 696Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 80 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,90 position, Receptacle,4mm stack height
Datu lapa
1 972Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 90 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 24 Positions, Header, 1.5mm Stack Height
Datu lapa
4 879Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 24 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 34 Positions, Header, 1.5mm Stack Height
Datu lapa
4 990Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 34 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 70position, Receptacle,1.5mm stack height
Datu lapa
2 832Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Receptacles 70 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,70 position, Receptacle,4mm stack height
Datu lapa
2 990Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 70 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 90position, Receptacle,1.5mm stack height
Datu lapa
2 825Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Receptacles 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 70 Positions, Header, 1.5mm Stack Height
Datu lapa
4 972Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 70 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 90 Positions, Header, 1.5mm Stack Height
Datu lapa
4 880Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 90 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 50 position, Header,1.50mm stack height
Datu lapa
3 855Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000
Headers 50 Position 0.4 mm (0.016 in) 1 Row Solder Vertical 1.5 mm, 4 mm 300 mA 30 V - 40 C + 125 C Gold Thermoplastic (TP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,50 position, Receptacle,1.5mm stack height
Datu lapa
2 103Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 50 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,60 position, Receptacle,4mm stack height
Datu lapa
2 870Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 60 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,80 position, Receptacle,4mm stack height
Datu lapa
1 603Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 80 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,100 position, Receptacle,4mm stack height
Datu lapa
3 160Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 100 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 60 Positions, Header, 1.5mm Stack Height
Datu lapa
3 310Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 60 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 100 position, Header,1.5mm stack height
Datu lapa
1 444Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000
Headers 100 Position 0.4 mm (0.016 in) 1 Row Solder Vertical 1.5 mm, 4 mm 300 mA 30 V - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,40 position, Receptacle,4mm stack height
Datu lapa
1 488Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 2 000

Receptacles 40 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 4 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape, MouseReel
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 60position, Receptacle,1.5mm stack height
Datu lapa
1 452Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 3 000

Receptacles 60 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 30 Positions, Header, 1.5mm Stack Height
Datu lapa
2 956Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 5 000
Headers 30 Position 0.4 mm (0.016 in) 1 Row Solder Vertical 1.5 mm, 4 mm 300 mA 30 V - 40 C + 125 C Gold Thermoplastic (TP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 40 Positions, Header, 1.5mm Stack Height
Datu lapa
2 886Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 5 000
Headers 40 Position 0.4 mm (0.016 in) 1 Row Solder Vertical 1.5 mm, 4 mm 300 mA 30 V - 40 C + 125 C Gold Thermoplastic (TP) .40mm Reel, Cut Tape, MouseReel
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm, 80position, Receptacle,1.5mm stack height
Datu lapa
140Ir noliktavā
5 000Paredzamais 13.03.2026
Min.: 1
Vair.: 1
Rullis: 5 000

Receptacles 80 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,100 position, Receptacle,1.5mm stack height
Datu lapa
14 974Paredzamais 03.04.2026
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 5 000

Receptacles 100 Position 0.4 mm (0.016 in) 1 Row Solder Vertical 1.5 mm 300 mA 30 V - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape, MouseReel
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.40mm, 20 Positions, Header, 1.5mm Stack Height
Datu lapa
10 000Paredzamais 08.05.2026
Min.: 1
Vair.: 1
Rullis: 5 000

Headers 20 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,10 position, Receptacle,1.5mm stack height
Datu lapa
Noliktavā neesošas preces izpildes laiks 10 Nedēļas
Min.: 1
Vair.: 1
Rullis: 5 000

Receptacles 10 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape
Amphenol FCI Board to Board un mezanīna savienotāji BergStak 0.4mm,20 position, Receptacle,1.5mm stack height
Datu lapa
Noliktavā neesošas preces izpildes laiks 10 Nedēļas
Min.: 1
Vair.: 1
Rullis: 3 000

Receptacles 20 Position 0.4 mm (0.016 in) 2 Row Solder Vertical 1.5 mm 300 mA 30 V 16 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) .40mm Reel, Cut Tape