Multiprotokola moduļi

Rezultāti: 1 522
Atlasīt Attēls Detaļas Nr.
 Raž.
Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu.
Daudz. RoHS ECAD modelis Sērija
Frekvence
Izejas jauda
Saskarnes tips
Barošanas spriegums - min.
Barošanas spriegums - maks.
Minimālā darba temperatūra
Maksimālā darba temperatūra
Antenas savienotāja tips
Izmēri
Protokols - Bluetooth, BLE - 802.15.1
Protokols - šūnas, NBIoT, LTE
Protokols - GPS, GLONASS
Protokols - Sub GHz
Protokols - WiFi - 802.11
Protokols - ANT, Thread, Zigbee - 802.15.4
Kvalifikācija
Iepakojums
Murata Electronics Multiprotokola moduļi Type 1XL Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Datu lapa
1 830Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 1 000

1XL 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UART 1.71 V 3.46 V - 40 C + 60 C Without Antenna 19.1 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Ezurio Multiprotokola moduļi BLE v4.2 Module NFC Integrated Ant. (Nordic nRF52832)
Datu lapa
906Ir noliktavā
Min.: 1
Vair.: 1

BL65x 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C Chip 14 mm x 10 mm x 2.1 mm Bluetooth LE NFC Cut Tape
Intel AX210.NGWG.NVX
Intel Multiprotokola moduļi Intel Killer Wi-Fi 6E AX1675 x (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 397Ir noliktavā
Min.: 1
Vair.: 1

2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Intel AX210.NGWGIE.NV99ARN4
Intel Multiprotokola moduļi Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 152Ir noliktavā
Min.: 1
Vair.: 1

Intel AX211.NGWG.NV
Intel Multiprotokola moduļi Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro
Datu lapa
426Ir noliktavā
Min.: 1
Vair.: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Insight SiP Multiprotokola moduļi nRF52832 LoRa Transceiver & BLE 5 Module AS
Datu lapa
69Ir noliktavā
Min.: 1
Vair.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Telink Multiprotokola moduļi Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datu lapa
6Ir noliktavā
Min.: 1
Vair.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink Multiprotokola moduļi Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datu lapa
6Ir noliktavā
Min.: 1
Vair.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel Multiprotokola moduļi Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Datu lapa
28Ir noliktavā
Min.: 1
Vair.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
M5Stack Multiprotokola moduļi a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash
Datu lapa
10Ir noliktavā
Min.: 1
Vair.: 1

I2C 25.93 mm x 18 mm x 4.7 mm
CEL Multiprotokola moduļi CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Datu lapa
2Ir noliktavā
Min.: 1
Vair.: 1

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology Multiprotokola moduļi [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Datu lapa
10Ir noliktavā
Min.: 1
Vair.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Silex Technology Multiprotokola moduļi [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Datu lapa
15Ir noliktavā
Min.: 1
Vair.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
u-blox Multiprotokola moduļi 88W8887, 802.11ac+BT, 1 antenna pin
Datu lapa
278Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C External 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel, Cut Tape
Pulse Electronics Multiprotokola moduļi USB 802.11 b/g/n BT module
746Ir noliktavā
Min.: 1
Vair.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
HMS Networks Multiprotokola moduļi Wireless Bolt-CAN Interface
Datu lapa

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Intel Multiprotokola moduļi Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Datu lapa
490Ir noliktavā
Min.: 1
Vair.: 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax
Silex Technology Multiprotokola moduļi [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Datu lapa
253Ir noliktavā
97Paredzamais 29.04.2026
Min.: 1
Vair.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Multiprotokola moduļi [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
Datu lapa
161Ir noliktavā
Min.: 1
Vair.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Seeed Studio Multiprotokola moduļi The factory is currently not accepting orders for this product. 188Ir noliktavā
Min.: 1
Vair.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Ezurio Multiprotokola moduļi RF Module, Sterling LWB+, Chip Antenna, CutTape CYW43439
Datu lapa
154Ir noliktavā
1 000Paredzamais 11.08.2026
Min.: 1
Vair.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Silicon Labs Multiprotokola moduļi Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datu lapa
99Ir noliktavā
Min.: 1
Vair.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio Multiprotokola moduļi RF Module, Sterling LWB+, MHF4, Cut Tape CYW43439
Datu lapa
75Ir noliktavā
Min.: 1
Vair.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Lantronix Multiprotokola moduļi BOLERO43 - EMEA - LTE CAT-M1 band 20, 8, 3, 7- 2G FB band 8, 3 - IP 67 GNSS - LI ON BATTERY BACKUP - RS232 - 10 WIRE AS FOLLOW - 2 WIRES - 2 I/O - 1 WIRE INTERFACE - CAN BUS SUPPORT - AVL SOFTWARE.
Datu lapa

BOLERO RS-232 10.8 V 48 V LTE Cat-M1 GNSS Bulk
Intel Multiprotokola moduļi Intel Wi-Fi 6 AX101, 2230, 1x1 AX+BT, No vPro
Datu lapa
63Ir noliktavā
Min.: 1
Vair.: 1

Wi-Fi 6 AX101 22 mm x 30 mm x 2.4 mm Bluetooth 802.11 ax