SEARAY™ SEAF & SEAM Connectors

Samtec SEARAY™ SEAF and SEAM Connectors feature a 1.27mm pitch grid, a rugged Edge Rate®contact system, and up to 56Gbps high-speed performance. SEAF high-density socket connectors series includes the SEAF-RA right-angle socket, the SEAF8 0.8mm open-pin-field array, the SEAFP press-fit socket, and the SEAFP-RA right-angle press-fit socket. The SEAM connectors feature low insertion/withdrawal forces and are available in 7mm to 17.5mm stack heights. Samtec SEARAY SEAF and SEAM Connectors meet IPC-A-610F and IPC J-STD-001F standards.

Rezultāti: 773
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Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
1 206Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
2 973Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
1 436Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
339Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
222Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
472Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
207Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
403Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 200

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
52Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 75

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
635Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 250

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
176Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
264Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 200

Connectors 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
160Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
66Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 75

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
192Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
426Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
198Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
181Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 175

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
250Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
495Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
266Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
49Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
167Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
128Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 75

Connectors 500 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
129Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape