5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Rezultāti: 4 277
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Daudz. RoHS ECAD modelis Produkts
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Krautnes augstums
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Maksimālais datu pārraides ātrums
Minimālā darba temperatūra
Maksimālā darba temperatūra
Kontakta pārklājums
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Iepakojums
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
6 945Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 500

Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
2 560Ir noliktavā
Min.: 1
Vair.: 1

Sockets 180 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
1 206Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
1 436Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datu lapa
1 955Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
400Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
2 973Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
192Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
101Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
91Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 125

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
133Ir noliktavā
Min.: 1
Vair.: 1

Sockets 84 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
329Ir noliktavā
Min.: 1
Vair.: 1

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
326Ir noliktavā
Min.: 1
Vair.: 1

Connectors 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
1 060Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 150

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
433Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji Q Strip High-Speed Ground Plane Header
Datu lapa
763Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 100

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datu lapa
401Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 425

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datu lapa
1 127Ir noliktavā
MouseReel ir pieejams
Min.: 1
Vair.: 1
Rullis: 425

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datu lapa
613Ir noliktavā
Min.: 1
Vair.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datu lapa
150Ir noliktavā
Min.: 1
Vair.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datu lapa
426Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datu lapa
186Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
190Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 525

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
398Ir noliktavā
Min.: 1
Vair.: 1

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board un mezanīna savienotāji 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datu lapa
240Ir noliktavā
Min.: 1
Vair.: 1
Rullis: 500
Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape